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Effect of the TiC content on microstructure and thermal properties of Cu TiC composites prepared by powder metallurgy       
Yazarlar
Soner Buytoz
Fırat Üniversitesi, Türkiye
Fethi Dağdelen
Fırat Üniversitesi, Türkiye
Prof. Dr. Serkan ISLAK
Kastamonu Üniversitesi, Türkiye
Mediha Kök
Fırat Üniversitesi, Türkiye
Durmuş Kır
Kocaeli Üniversitesi, Türkiye
Ercan Ercan
Bitlis Eren Üniversitesi, Türkiye
Özet
Copper matrix with an individual addition of TiC particles was prepared by means of powder metallurgy and hot pressing process, and the effect of TiC addition on microstructure, thermal properties, and electrical conductivity of Cu-TiC composites was investigated. The TiC quantity was changed as 1, 3, 5, 10, and 15 Cu (in mass%), and Cu-TiC powder mixtures were hot-pressed for 4 min at 700 °C under an applied pressure of 50 MPa. Microstructure studies revealed that TiC particles were distributed uniformly in the Cu matrix. Thermal Analysis result showed that there were two exothermic peaks and with rising TiC rate, oxidation amount of Cu composite decreased. With the increasing addition of TiC, hardness of composites changed between 58.6 HV0.1 and 87.8 HV 0.1. The highest electrical conductivity for Cu-TiC composites was obtained in the Cu-1 mass% TiC composite, with approximately 81.2 % IACS. © 2014 Akadémiai Kiadó, Budapest, Hungary.
Anahtar Kelimeler
Cu-TiC | Electrical conductivity | Hot pressing | Microstructure | Thermal properties
Makale Türü Özgün Makale
Makale Alt Türü SSCI, AHCI, SCI, SCI-Exp dergilerinde yayımlanan tam makale
Dergi Adı JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
Dergi ISSN 1388-6150
Dergi Tarandığı Indeksler SCI-Expanded
Makale Dili İngilizce
Basım Tarihi 09-2014
Cilt No 117
Sayı 3
Sayfalar 1277 / 1283
Doi Numarası 10.1007/s10973-014-3900-6
Makale Linki http://link.springer.com/10.1007/s10973-014-3900-6